Samsung is reportedly planning to redesign its sixth-generation 1c DRAM technology to boost yield rates and secure a competitive position in the upcoming HBM4 production.
Importance of Samsung’s 1c DRAM Chip for HBM4 and Memory Business Success
The major Korean tech company is considering overhauling its 1c DRAM manufacturing process, which is crucial for the success of its HBM4 products. As reported by ZDNet Korea, Samsung has been weighing different design strategies for its advanced DRAM processes since the latter half of 2024. They have now reimagined their high-performance 1c DRAM to ensure the new HBM iterations gain widespread industry adoption, unlike the previous HBM3 versions that struggled with integration challenges, especially with partners like NVIDIA.
According to the report, Samsung’s advanced DRAM process initially fell short of its desired yield rates, pegged at about 60%-70%, which delayed the move towards mass production. The root of the problem appears to be the size of the 1c DRAM chip. Samsung originally focused on downsizing the chip to boost production volume. However, this strategy compromised process stability, leading to reduced yield rates.
"Samsung Electronics has changed the design of its 1c DRAM to increase its chip size and is focusing on improving yields, targeting the middle of this year. It appears that they are focused on stable mass production of next-generation memory even if it costs more."
– ZDNet Korea
Samsung’s 1c DRAM process is a decisive factor for the success of their HBM4 products. With rivals like SK Hynix and Micron having already optimized their designs, Samsung is against the clock. The company is under pressure to deliver due to its less-than-stellar industry standing post-HBM3 difficulties. Ensuring the 1c DRAM process aligns with industry expectations is essential.
While uncertainties surround the outcome of Samsung’s sixth-generation DRAM process, developments are anticipated in the coming months. If successful, these advancements could pave the way for the HBM4 process to be ready for mass production, likely by year’s end.
