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It seems that the tech giant from Taiwan, TSMC, isn’t in a hurry to embrace the High-NA EUV technology, as they’ve decided to bypass it for their A14 process.
### TSMC Takes a Step Back from High-NA EUV, Opts for Conventional Methods
For years, TSMC has led the charge in semiconductor innovation, often setting the industry’s pace. However, they’re now opting not to use the advanced High-NA EUV lithography for their A14 process, sticking instead with the more traditional 0.33-NA EUV method. This decision was unveiled at the NA Technology Symposium, with TSMC’s Senior Vice President, Kevin Zhang, making the announcement (as reported by Bits & Chips). As a result of this move, Intel Foundry and several DRAM producers gain a “technological” advantage over TSMC.
TSMC won’t utilize high-NA EUV lithography for A14 chip production, scheduled for 2028. Despite the technology spanning from 2 nanometers to A14, high-NA isn’t necessary, allowing us to maintain similar complexity in processing steps.
In each tech generation, we aim to minimize mask increases, which is crucial for providing a cost-effective solution.
— Kevin Zhang, TSMC
Stay tuned as this story unfolds…
